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Business Description
Engion, established Aug. 2003, has Semiconductor Biz Div. and System Biz Div. In Semiconductor Biz Div., Engion provide foundary service for wafer back-end process such as Back-Grinding, Sawing, Reconstruction, and Chip-sorting (Pick & Place COG). In System Biz Div, with Engion's own unique algorithm for defect location, Engion's system provide superior performance on Automative Macro inspection system.
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