Guangdong Longxing Integrated Circuit Co., Ltd.

Guangdong Longxing Integrated Circuit was initially established in Huizhou City, Guangdong Province in 2012. Later, due to the transformation of its product structure, it moved and is now Guangdong Longxing Integrated Circuit Co., Ltd. is located in Dongguan City, Guangdong Province, China. It is an enterprise specialized in the production and research & development of high-quality ceramic-based circuit boards with (DPC/DBC/AMB/TGV) processes. The types of its substrates cover alumina-zirconia, beryllium oxide-aluminum nitride, silicon nitride-silicon carbide, ferrite, sapphire, quartz glass, polycrystalline silicon wafers, diamond and so on. The company has a professional management and research & development team and has obtained the IATF 16949 quality management system certification. Having been in the circuit board industry for nearly 15 years, it is a modern technology company featuring rapid response, on-time delivery, quality assurance and integrated pre-sales and after-sales services. Our cooperative customers include large high-tech enterprises such as Tesla, Byd, Huawei, Hgtech, Verizon, Samsung, ZTe, and Vanrun, In the future, we will focus on delivering supporting circuit products for 5G base stations, new energy AMB (Active Metal Brazing), HTCC (High Temperature Co-fired Ceramic) and so on, The products cover optical communication modules, laser thermal imaging, laser guidance, 400g optical modules, IGBT Sensors, aerospace cooling chips, superhigh-power light source transmitters and so on

We are looking forward to jointly exploring and researching new types of circuit products with you and achieving mutual assistance and mutual benefitIts process manufacturing capabilities are as follows:

The thickness of the circuit board ranges from 0.1 mm to 3.0 mm.

The maximum size is 200 × 200 mm.

The thickness of copper ranges from 500 nanometers to 3 mm.

The thickest solder resist ink can reach 200 micrometers.

The minimum line width and line spacing is 50 micrometers.

For flat circuit boards, the fastest delivery time is within 72 hours, while for 3D dam circuit boards, the fastest delivery time is within 12 days.

The surface treatment methods include copper plating and gold plating, nickel plating and gold plating, copper plating and palladium-gold plating, nickel plating and palladium-gold plating, silver plating, electroplating thick gold, electroplating silver, gold-tin alloy and anti-oxidation treatment.

It can realize the metallization of special-shaped boards such as those with bumps and hollows, 3D special-shaped metallization, and can also be customized according to requirements.

High-density interconnect (HDI) circuit boards with 1 to 20 layers