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1 SCIENCE PARK ROAD SINGAPORE, SCIENCE PARK 2
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Business Description
The Next-gen Thermo Compression Bonding
9800 TC next
BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.
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≤ 1h
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1
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